公开(公告)号：US20100051580A1

公开(公告)日：2010-03-04

申请号：US12428808

申请日：2009-04-23

申请人： Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

发明人： Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

IPC分类号： B44C1/22 ,  B41J2/015

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639

摘要： A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.

摘要翻译： 制造喷墨打印头的方法包括在基板上形成具有多个墨室的腔层。 牺牲层被形成并被配置成填充与腔室层上的墨水室相关联的空间。 喷嘴层形成在腔室层和牺牲层的顶表面上并且具有多个喷嘴。 在基板的底表面上制备蚀刻掩模。 蚀刻掩模具有至少一个线性蚀刻图案，其被配置为限定要在其中形成供墨孔的基板的一部分。 通过线性蚀刻图案蚀刻衬底，直到牺牲层被暴露并形成通孔。 通孔限定要在其中形成供墨孔的基板部分。 牺牲层和由通孔包围的基板的部分被去除以形成供墨孔。

公开(公告)号：US08216482B2

公开(公告)日：2012-07-10

申请号：US12428808

申请日：2009-04-23

申请人： Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

发明人： Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

IPC分类号： G01D15/00 ,  G11B5/127 ,  C23F1/00 ,  H01L21/00 ,  H01L21/311

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639

摘要： A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.

摘要翻译： 制造喷墨打印头的方法包括在基板上形成具有多个墨室的腔层。 牺牲层被形成并被配置成填充与腔室层上的墨水室相关联的空间。 喷嘴层形成在腔室层和牺牲层的顶表面上并且具有多个喷嘴。 在基板的底表面上制备蚀刻掩模。 蚀刻掩模具有至少一个线性蚀刻图案，其被配置为限定要在其中形成供墨孔的基板的一部分。 通过线性蚀刻图案蚀刻衬底，直到牺牲层被暴露并形成通孔。 通孔限定要在其中形成供墨孔的基板部分。 牺牲层和由通孔包围的基板的部分被去除以形成供墨孔。

公开(公告)号：US08109609B2

公开(公告)日：2012-02-07

申请号：US12416954

申请日：2009-04-02

申请人： Dong-Sik Shim ,  Yong-Seop Yoon ,  Bang-Weon Lee ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Jong-Seok Kim

发明人： Dong-Sik Shim ,  Yong-Seop Yoon ,  Bang-Weon Lee ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Jong-Seok Kim

IPC分类号： B41J2/14

CPC分类号： B41J2/14145

摘要： Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.

摘要翻译： 公开了一种喷墨装置及其制造方法。 所公开的喷墨装置包括喷墨头，其包括基板，该基板包括形成在基板的后表面中并且使墨供给孔暴露的多个通孔，堆叠的腔层 在基板上，以及层叠在室层上的喷嘴层，并且包括附接到喷墨头并包括相对于通孔具有相应布置的多个供墨槽的基座。