发明授权
- 专利标题: High-speed semiconductor device and method for manufacturing the same
- 专利标题(中): 高速半导体器件及其制造方法
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申请号: US11990491申请日: 2006-08-01
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公开(公告)号: US08217466B2公开(公告)日: 2012-07-10
- 发明人: Kanji Otsuka , Fumio Mizuno , Munekazu Takano , Tamotsu Usami
- 申请人: Kanji Otsuka , Fumio Mizuno , Munekazu Takano , Tamotsu Usami
- 申请人地址: JP Kanagawa
- 专利权人: Jjtech Co., Ltd.
- 当前专利权人: Jjtech Co., Ltd.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Wenderoth, Lind & Ponack, LLP
- 优先权: JP2005-237253 20050818
- 国际申请: PCT/JP2006/315221 WO 20060801
- 国际公布: WO2007/020796 WO 20070222
- 主分类号: H01L21/70
- IPC分类号: H01L21/70
摘要:
Disclosed is a semiconductor device wherein the switching speed of a transistor is increased. Specifically disclosed is a semiconductor device comprising a semiconductor layer formed on a part of an insulating layer, a first transistor formed on a lateral face of the semiconductor layer and having a first gate insulating film, a first gate electrode and two first impurity layers forming a source and a drain, and a second transistor formed on another lateral face of the semiconductor layer and having a second gate insulating film, a second gate electrode and two second impurity layers forming a source and a drain.
公开/授权文献
- US20090096029A1 Semiconductor Device and Manufacturing Method Thereof 公开/授权日:2009-04-16
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