Invention Grant
US08217522B2 Printed circuit board with coextensive electrical connectors and contact pad areas
有权
印刷电路板，具有相同的电连接器和接触垫区域
- Patent Title: Printed circuit board with coextensive electrical connectors and contact pad areas
- Patent Title (中): 印刷电路板，具有相同的电连接器和接触垫区域
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Application No.: US12819840Application Date: 2010-06-21
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Publication No.: US08217522B2Publication Date: 2012-07-10
- Inventor: Chih-Chin Liao , Han-Shiao Chen , Chin-Tien Chiu , Ken Jian Ming Wang , Cheeman Yu , Hem Takiar
- Applicant: Chih-Chin Liao , Han-Shiao Chen , Chin-Tien Chiu , Ken Jian Ming Wang , Cheeman Yu , Hem Takiar
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus & DeNiro LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
Public/Granted literature
- US20100252315A1 Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas Public/Granted day:2010-10-07
Information query
IPC分类:
