Invention Grant
- Patent Title: Methods of atomic layer deposition using titanium-based precursors
- Patent Title (中): 使用钛基前体的原子层沉积方法
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Application No.: US12207973Application Date: 2008-09-10
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Publication No.: US08221852B2Publication Date: 2012-07-17
- Inventor: Peter Nicholas Heys , Andrew Kingsley , Fuquan Song , Paul Williams , Thomas Leese , Hywel Owen Davies , Rajesh Odedra
- Applicant: Peter Nicholas Heys , Andrew Kingsley , Fuquan Song , Paul Williams , Thomas Leese , Hywel Owen Davies , Rajesh Odedra
- Applicant Address: US MO St. Louis
- Assignee: Sigma-Aldrich Co. LLC
- Current Assignee: Sigma-Aldrich Co. LLC
- Current Assignee Address: US MO St. Louis
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H05H1/24
- IPC: H05H1/24 ; C23C16/00 ; C23C8/00

Abstract:
Methods of forming titanium-containing films by atomic layer deposition are provided. The methods comprise delivering at least one precursor to a substrate, wherein the at least one precursor corresponds in structure to Formula I: wherein: R is C1-C6-alkyl; n is zero, 1, 2, 3, 4 or 5; L is C1-C6-alkoxy or amino, wherein the amino is optionally independently substituted 1 or 2 times with C1-C6-alkyl.
Public/Granted literature
- US20090074983A1 METHODS OF ATOMIC LAYER DEPOSITION USING TITANIUM-BASED PRECURSORS Public/Granted day:2009-03-19
Information query
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