- 专利标题: Method and structure for gate height scaling with high-k/metal gate technology
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申请号: US13364564申请日: 2012-02-02
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公开(公告)号: US08227870B2公开(公告)日: 2012-07-24
- 发明人: Michael P. Chudzik , Ricardo A. Donaton , William K. Henson , Yue Liang
- 申请人: Michael P. Chudzik , Ricardo A. Donaton , William K. Henson , Yue Liang
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Joseph P. Abate
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119
摘要:
A method and structure to scale metal gate height in high-k/metal gate transistors. A method includes forming a dummy gate and at least one polysilicon feature, all of which are formed from a same polysilicon layer and wherein the dummy gate is formed over a gate metal layer associated with a transistor. The method also includes selectively removing the dummy gate while protecting the at least one polysilicon feature. The method further includes forming a gate contact on the gate metal layer to thereby form a metal gate having a height that is less than half a height of the at least one polysilicon feature.
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