发明授权
US08227904B2 Multi-chip package and method of providing die-to-die interconnects in same
有权
多芯片封装和提供芯片间裸片互连的方法
- 专利标题： Multi-chip package and method of providing die-to-die interconnects in same
- 专利标题（中）： 多芯片封装和提供芯片间裸片互连的方法
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申请号： US12459007申请日： 2009-06-24
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公开(公告)号： US08227904B2公开(公告)日： 2012-07-24
- 发明人: Henning Braunisch , Chia-Pin Chiu , Aleksandar Aleksov , Hinmeng Au , Stefanie M. Lotz , Johanna M. Swan , Sujit Sharan
- 申请人： Henning Braunisch , Chia-Pin Chiu , Aleksandar Aleksov , Hinmeng Au , Stefanie M. Lotz , Johanna M. Swan , Sujit Sharan
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理商 Kenneth A. Nelson
- 主分类号： H01L23/538
- IPC分类号： H01L23/538
摘要：
A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).