Invention Grant
- Patent Title: Defects inspecting apparatus and defects inspecting method
- Patent Title (中): 缺陷检查设备和缺陷检查方法
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Application No.: US13221935Application Date: 2011-08-31
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Publication No.: US08228495B2Publication Date: 2012-07-24
- Inventor: Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
- Applicant: Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2002-344327 20021127
- Main IPC: G01N21/00
- IPC: G01N21/00
Abstract:
An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.
Public/Granted literature
- US20110310382A1 DEFECTS INSPECTING APPARATUS AND DEFECTS INSPECTING METHOD Public/Granted day:2011-12-22
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