Invention Grant
- Patent Title: Method for ultra thin wafer handling and processing
- Patent Title (中): 超薄晶圆处理和加工方法
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Application No.: US12731281Application Date: 2010-03-25
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Publication No.: US08232140B2Publication Date: 2012-07-31
- Inventor: Ku-Feng Yang , Weng-Jin Wu , Wen-Chih Chiou , Tsung-Ding Wang
- Applicant: Ku-Feng Yang , Weng-Jin Wu , Wen-Chih Chiou , Tsung-Ding Wang
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for thin wafer handling and processing is provided. In one embodiment, the method comprises providing a wafer having a plurality of semiconductor chips, the wafer having a first side and a second side. A plurality of dies are attached to the first side of the wafer, at least one of the dies are bonded to at least one of the plurality of semiconductor chips. A wafer carrier is provided, wherein the wafer carrier is attached to the second side of the wafer. The first side of the wafer and the plurality of dies are encapsulated with a planar support layer. A first adhesion tape is attached to the planar support layer. The wafer carrier is then removed from the wafer and the wafer is diced into individual semiconductor packages.
Public/Granted literature
- US20100244284A1 METHOD FOR ULTRA THIN WAFER HANDLING AND PROCESSING Public/Granted day:2010-09-30
Information query
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