发明授权
- 专利标题： Lead free solder interconnections for integrated circuits
- 专利标题（中）： 集成电路的无铅焊接互连
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申请号： US12729021申请日： 2010-03-22
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公开(公告)号： US08232643B2公开(公告)日： 2012-07-31
- 发明人: Yao-Chun Chuang , Ching-Wen Hsiao , Chen-Cheng Kuo , Chen-Shien Chen
- 申请人： Yao-Chun Chuang , Ching-Wen Hsiao , Chen-Cheng Kuo , Chen-Shien Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60 ; H01L23/31
摘要：
Lead free solder interconnections for integrated circuits. A copper column extends from an input/output terminal of an integrated circuit. A cap layer of material is formed on the input/output terminal of the integrated circuit. A lead free solder connector is formed on the cap layer. A substrate having a metal finish solder pad is aligned with the solder connector. An intermetallic compound is formed at the interface between the cap layer and the lead free solder connector. A solder connection is formed between the input/output terminal of the integrated circuit and the metal finish pad that is less than 0.5 weight percent copper, and the intermetallic compound is substantially free of copper.