发明授权
- 专利标题： Bond pad for wafer and package for CMOS imager
- 专利标题（中）： 晶圆封装和CMOS成像器封装
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申请号： US13343422申请日： 2012-01-04
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公开(公告)号： US08232651B2公开(公告)日： 2012-07-31
- 发明人: James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard L. Rassel
- 申请人： James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard L. Rassel
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Anthony J. Canale
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seal between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.
公开/授权文献
- US20120098105A1 BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER 公开/授权日：2012-04-26
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