Invention Grant
- Patent Title: Methods and system for analysis and management of parametric yield
- Patent Title (中): 参数收益分析与管理方法与系统
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Application No.: US13216362Application Date: 2011-08-24
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Publication No.: US08239790B2Publication Date: 2012-08-07
- Inventor: James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
- Applicant: James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design.
Public/Granted literature
- US20110307846A1 METHODS AND SYSTEM FOR ANALYSIS AND MANAGEMENT OF PARAMETRIC YIELD Public/Granted day:2011-12-15
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