In an electronic component mounting apparatus, nozzle mechanisms are formed slender by providing shaft-type linear motors vertically upward of nozzle units and providing linear encoders vertically upward of the shaft-type linear motors, respectively. Thus, it becomes possible to reduce the occupational area of the individual nozzle mechanisms in XY directions (horizontal direction), thereby allowing the pitch of neighboring nozzles to be narrowed. It also becomes achievable to keep up with increasingly narrow mounting pitches of electronic components on boards of increasingly smaller-size and higher-integration.