发明授权
US08242612B2 Wiring board having piercing linear conductors and semiconductor device using the same
有权
具有穿孔线性导体的接线板和使用其的半导体器件
- 专利标题: Wiring board having piercing linear conductors and semiconductor device using the same
- 专利标题(中): 具有穿孔线性导体的接线板和使用其的半导体器件
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申请号: US12813692申请日: 2010-06-11
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公开(公告)号: US08242612B2公开(公告)日: 2012-08-14
- 发明人: Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
- 申请人: Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
- 申请人地址: JP Nagano
- 专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人地址: JP Nagano
- 代理机构: IPUSA, PLLC
- 优先权: JP2009-170469 20090721
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H05K1/00
摘要:
A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.
公开/授权文献
- US20110018144A1 WIRING BOARD AND SEMICONDUCTOR DEVICE 公开/授权日:2011-01-27
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