发明授权
US08242612B2 Wiring board having piercing linear conductors and semiconductor device using the same 有权
具有穿孔线性导体的接线板和使用其的半导体器件

Wiring board having piercing linear conductors and semiconductor device using the same
摘要:
A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.
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