Invention Grant
- Patent Title: Double patterning friendly lithography method and system
- Patent Title (中): 双重图案友好光刻方法和系统
-
Application No.: US12549087Application Date: 2009-08-27
-
Publication No.: US08245174B2Publication Date: 2012-08-14
- Inventor: Yi-Kan Cheng , Ru-Gun Liu , Lee-Chung Lu
- Applicant: Yi-Kan Cheng , Ru-Gun Liu , Lee-Chung Lu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method includes receiving an identification of a plurality of cells to be included in an integrated circuit (IC) layout, including a list of pairs of cells within the plurality of cells to be connected to each other. First routing paths are identified, to connect a maximum number of the pairs of cells using one-dimensional (1-D) routing between cells within those pairs of cells. Second routing paths are selected from a predetermined set of two-dimensional (2-D) routing patterns to connect any of the pairs of cells which cannot be connected by 1-D routing. The first and second routing paths are output to a machine readable storage medium to be read by a control system for controlling a semiconductor fabrication process to fabricate the IC.
Public/Granted literature
- US20110023002A1 DOUBLE PATTERNING FRIENDLY LITHOGRAPHY METHOD AND SYSTEM Public/Granted day:2011-01-27
Information query