发明授权
- 专利标题： Backside illuminated imaging sensor with reinforced pad structure
- 专利标题（中）： 带加强垫结构的背面照明成像传感器
-
申请号： US12620437申请日： 2009-11-17
-
公开(公告)号： US08247852B2公开(公告)日： 2012-08-21
- 发明人: Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
- 申请人： Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
- 申请人地址： US CA Santa Clara
- 专利权人： OmniVision Technologies, Inc.
- 当前专利权人： OmniVision Technologies, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely Sokoloff Taylor & Zafman LLP
- 主分类号： H01L31/14
- IPC分类号： H01L31/14
摘要：
A backside illuminated imaging sensor with reinforced pad structure includes a device layer, a metal stack, an opening and a frame. The device layer has an imaging array formed in a front side of the device layer and the imaging array is adapted to receive light from a back side of the device layer. The metal stack is coupled to the front side of the device layer where the metal stack includes at least one metal interconnect layer having a metal pad. The opening extends from the back side of the device layer to the metal pad to expose the metal pad for wire bonding. The frame is disposed within the opening to structurally reinforce the metal pad.
公开/授权文献
信息查询
IPC分类:
