发明授权
- 专利标题： Chip package structure including heat dissipation device and an insulation sheet
- 专利标题（中）： 芯片封装结构包括散热装置和绝缘片
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申请号： US12491096申请日： 2009-06-24
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公开(公告)号： US08247891B2公开(公告)日： 2012-08-21
- 发明人: Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
- 申请人： Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
- 申请人地址： TW Hsinchu
- 专利权人： Cyntec Co., Ltd.
- 当前专利权人： Cyntec Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Litron Patent & Trademark Office
- 优先权： TW97134720A 20080910
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/10 ; H01L23/34 ; H01L23/28
摘要：
A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.
公开/授权文献
- US20100059870A1 CHIP PACKAGE STRUCTURE 公开/授权日：2010-03-11
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