发明授权
- 专利标题: Plating apparatus
- 专利标题(中): 电镀装置
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申请号: US12966297申请日: 2010-12-13
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公开(公告)号: US08252167B2公开(公告)日: 2012-08-28
- 发明人: Fumio Kuriyama , Takashi Takemura , Nobutoshi Saito , Masaaki Kimura , Rei Kiumi
- 申请人: Fumio Kuriyama , Takashi Takemura , Nobutoshi Saito , Masaaki Kimura , Rei Kiumi
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, LLP.
- 优先权: JP2003-65476 20030311; JP2003-208315 20030821
- 主分类号: C25D7/00
- IPC分类号: C25D7/00 ; C25D17/00 ; C25B9/00
摘要:
A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.
公开/授权文献
- US20110073482A1 PLATING APPARATUS 公开/授权日:2011-03-31