发明授权
- 专利标题： Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit
- 专利标题（中）： 化学机械抛光水分散体，化学机械抛光法，化学机械抛光水分散体制备试剂盒
-
申请号： US12467729申请日： 2009-05-18
-
公开(公告)号： US08262435B2公开(公告)日： 2012-09-11
- 发明人: Eiichirou Kunitani , Atsushi Baba , Masayuki Motonari , Shoei Tsuji
- 申请人： Eiichirou Kunitani , Atsushi Baba , Masayuki Motonari , Shoei Tsuji
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2008-133972 20080522
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A chemical mechanical polishing aqueous dispersion includes: (A) an amino acid, (B) abrasive grains, (C) a surfactant, (D) an oxidizing agent, and (E) ammonia, the ratio (WA/WD) of the content (WA) of the amino acid to the content (WD) of the oxidizing agent being 1.5 to 6.0, and the ratio (WE/WD) of the content (WE) of the ammonia to the content (WD) of the oxidizing agent being 0.05 to 0.6.