Invention Grant
- Patent Title: High speed copper plating bath
- Patent Title (中): 高速镀铜浴
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Application No.: US12433657Application Date: 2009-04-30
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Publication No.: US08262894B2Publication Date: 2012-09-11
- Inventor: Xingling Xu , Eric Webb
- Applicant: Xingling Xu , Eric Webb
- Applicant Address: US WA Moses Lake
- Assignee: Moses Lake Industries, Inc.
- Current Assignee: Moses Lake Industries, Inc.
- Current Assignee Address: US WA Moses Lake
- Agency: Nutter McClennen & Fish LLP
- Agent Reza Mollaaghababa; Andrew W. Schultz
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D21/18 ; C25D5/02
Abstract:
A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.
Public/Granted literature
- US20100276292A1 HIGH SPEED COPPER PLATING BATH Public/Granted day:2010-11-04
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