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公开(公告)号：US20220389606A1
公开(公告)日：2022-12-08
申请号：US17765101
申请日：2020-09-25
发明人： Seung-hoe CHOE , Myeongjin HAN , Man KIM , Bung-uk YOO , Kyun-hwan LEE , Joo-yul LEE , Younghwon KWAN
摘要： Provided are a measurement method, an electrochemical measuring cell, and a measuring device which are capable of directly and continuously measuring the concentration of monovalent copper ions (Cu+), 3-mercaptopropyl sulfonate (MPS), or Cu+-MPS, which is a plating additive breakdown product, in a plating solution during a copper plating process.
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公开(公告)号：US11021803B2
公开(公告)日：2021-06-01
申请号：US16502455
申请日：2019-07-03
申请人： Xtalic Corporation
摘要： Electrodeposition bath compositions, additives, and maintenance methods are described. In one embodiment, an electrodeposition bath includes at least a first metal ionic species that reacts with a second metal ionic species to maintain either the first and/or second metal ionic species in a desired oxidation state for electrodeposition.
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公开(公告)号：US10738389B2
公开(公告)日：2020-08-11
申请号：US14847374
申请日：2015-09-08
发明人： Takashi Izumi , Fumitoshi Ikegaya
摘要： A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.
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公开(公告)号：US10718062B2
公开(公告)日：2020-07-21
申请号：US16514357
申请日：2019-07-17
发明人： Charles L. Arvin , Glen N. Biggs , Phillip W. Palmatier , Joseph C. Sorbello , Tracy A. Tong , Freddie Torres
IPC分类号： C25B9/06 , C25B9/00 , C25B9/12 , C25D17/06 , C25D21/12 , C25D17/00 , C25D21/14 , C25D5/08 , C25D21/18 , C25D17/02 , C25D21/08 , C25D21/10
摘要： Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.
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公开(公告)号：US20200165737A1
公开(公告)日：2020-05-28
申请号：US16777008
申请日：2020-01-30
申请人： EBARA CORPORATION
IPC分类号： C25D3/28 , C25D17/10 , C01G3/02 , C25D21/12 , C25D17/02 , C25D21/18 , C25D17/00 , C25D7/12 , C25D21/14 , C25D3/38
摘要： Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.
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公开(公告)号：US10590561B2
公开(公告)日：2020-03-17
申请号：US15335186
申请日：2016-10-26
摘要： A chemical bath system includes a reactor tank configured to store a chemical bath solution including at least one organic element, and an organics removing chamber assembly. The organics removing chamber assembly includes at least one sub-chamber that delivers the chemical bath solution from a high-pressure section of a bath circuit to a low-pressure section. The organics removing chamber assembly modifies an amount of the at least one organic element as the chemical bath solution flows therethrough. The chemical bath system further includes an analysis/dosing controller. The analysis/dosing controller outputs a control signal that controls the organics removing chamber assembly to modify the amount of the at least one organic element in the chemical bath solution based on a comparison between an actual amount of the at least one organic element in the chemical bath solution and a desired amount of the at least one organic element.
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公开(公告)号：US10480086B2
公开(公告)日：2019-11-19
申请号：US15525778
申请日：2015-11-23
IPC分类号： C25B9/02 , C25C1/00 , C25C7/00 , C25D17/12 , C25B9/08 , C25B9/10 , C25C7/04 , C25B15/08 , H01M8/18 , C25D17/02 , C25D21/18 , H01M8/08
摘要： Multipurpose electrolytic device (EMPD) for forced or spontaneous electrolytic processes, which incorporates selective and unidirectional ion exchange membranes in order to separate between two or more compartments and allow electrical conductivity therebetween, with independent electrolytes for controlled electrolytic ion transformation, regardless of the chemical composition of the electrolyte containing the element of interest, with high faradaic efficiency and high energy performance. The invention also relates to a method. The device can be used for processes such as metal electrowinning (EW), metal electrorefining, electrooxidation (EOXI) and electroreduction (ERED) of ionic species. The device uses two independent, energetically suitable electrolytes, which allow controlled electrolytic ion transformation, with high faradaic efficiency and high energy performance, unlike current forced electrolysis methods, which operate with a common electrolyte. The device can be used in any aqueous medium, for example an acid environment, such as sulphuric, hydrochloric or other acid, a caustic-soda-based alkaline, or ammonium, thiocyanate or thiosulfate salts, with or without the presence of organic reactants.
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公开(公告)号：US20190301048A1
公开(公告)日：2019-10-03
申请号：US16252903
申请日：2019-01-21
发明人： Teruyuki HOTTA , Kouji SHIMIZU , Masayuki UTSUMI , Masato ARATANI
摘要： A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath 2 is rotated, parts 20 contact an electrode 50 to be electroplated. In this event, a plating liquid 16 is used as circulated by a pump P. The plating liquid 16 is discharged to the outside through a gap in a side wall 80 for replacement of the plating liquid 16 or the like. During discharge, the plating liquid 16 is not circulated by the pump P. The gap 8 which is formed in the side wall 80 is formed to be smaller than the minimum dimension of the parts 20 on the inner side. The gap 8 is formed to be wider toward the outer side. Thus, water is discharged immediately.
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公开(公告)号：US10345254B2
公开(公告)日：2019-07-09
申请号：US15689195
申请日：2017-08-29
发明人： Yung-Chang Huang , Jui-Mu Cho , Chien-Hsun Pan , Chun-Chih Lin
IPC分类号： G01N27/26 , C25D13/18 , C25D13/02 , G01N27/416 , C25D21/14 , C25D21/18 , H01L21/66 , C25B11/04 , C25D3/38
摘要： Detection methods for an electroplating process are provided. A detection method includes immersing a substrate into an electrolyte solution to perform an electroplating process. The electrolyte solution includes an additive agent. The detection method also includes immersing a detection device into the electrolyte solution. The detection method further includes applying a first alternating current (AC) voltage or direct current (DC) voltage to the detection device to detect the concentration of the additive agent. In addition, the detection method includes applying a combination of a second AC voltage and a second DC voltage to the detection device to inspect the electrolyte solution. An impurity is detected in the electrolyte solution. The detection method also includes replacing the electrolyte solution containing the impurity with another electrolyte solution.
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公开(公告)号：US20190203375A1
公开(公告)日：2019-07-04
申请号：US15894643
申请日：2018-02-12
发明人： Tighe A. Spurlin , Jonathan D. Reid
摘要： In one example, an electroplating system comprising a bath reservoir having a first inlet for feeding fresh electrolyte solution into the bath reservoir and a first outlet for bleeding used electrolyte solution out of the bath reservoir, a second inlet for receiving recycled electrolyte solution into the bath reservoir, and a second outlet for discharge0 of electrolyte solution from the bath reservoir. A plating cell is providing for electroplating an object, the plating cell has an inlet in direct or indirect fluid communication with the bath reservoir, and an outlet for discharge of electrolyte solution from the plating cell. An extraction column extracts by-products generated by the plating cell and has an inlet in direct or indirect fluid communication with the outlet of the plating cell, and an outlet for discharge of electrolyte solution from the extraction column. A first particle filter is disposed in a fluid pathway between the second outlet of the bath reservoir and the inlet of the plating cell, and a second particle filter is disposed in a fluid pathway between the outlet of the extraction column and the second inlet of the bath reservoir.
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