发明授权
- 专利标题: Power semiconductor component with charge compensation structure and method for the fabrication thereof
- 专利标题(中): 具有电荷补偿结构的功率半导体元件及其制造方法
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申请号: US12350776申请日: 2009-01-08
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公开(公告)号: US08263450B2公开(公告)日: 2012-09-11
- 发明人: Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
- 申请人: Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Eschweiler & Associates, LLC
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A semiconductor component with charge compensation structure has a semiconductor body having a drift path between two electrodes. The drift path has drift zones of a first conduction type, which provide a current path between the electrodes in the drift path, while charge compensation zones of a complementary conduction type constrict the current path of the drift path. For this purpose, the drift path has two alternately arranged, epitaxially grown diffusion zone types, the first drift zone type having monocrystalline semiconductor material on a monocrystalline substrate, and a second drift zone type having monocrystalline semiconductor material in a trench structure, with complementarily doped walls, the complementarily doped walls forming the charge compensation zones.
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