Invention Grant
- Patent Title: Method for packaging semiconductor device
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Application No.: US13064646Application Date: 2011-04-06
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Publication No.: US08278145B2Publication Date: 2012-10-02
- Inventor: Chien-Wen Chen , Longqiang Zu , Chen-Fa Tsai
- Applicant: Chien-Wen Chen , Longqiang Zu , Chen-Fa Tsai
- Applicant Address: TW Hsinchu
- Assignee: Global Unichip Corporation
- Current Assignee: Global Unichip Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Bacon & Thomas, PLLC
- Priority: TW99124266A 20100723
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.
Public/Granted literature
- US20120021564A1 Method for packaging semiconductor device Public/Granted day:2012-01-26
Information query
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