Invention Grant
- Patent Title: LDD epitaxy for FinFETs
- Patent Title (中): FinFET的LDD外延
-
Application No.: US12720476Application Date: 2010-03-09
-
Publication No.: US08278179B2Publication Date: 2012-10-02
- Inventor: Da-Wen Lin , Che-Min Chu , Tsung-Hung Li , Chih-Hung Tseng , Yen-Chun Lin , Chung-Cheng Wu
- Applicant: Da-Wen Lin , Che-Min Chu , Tsung-Hung Li , Chih-Hung Tseng , Yen-Chun Lin , Chung-Cheng Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method of forming a semiconductor structure includes providing a substrate including a fin at a surface of the substrate, and forming a fin field-effect transistor (FinFET), which further includes forming a gate stack on the fin; forming a thin spacer on a sidewall of the gate stack; and epitaxially growing a epitaxy region starting from the fin. After the step of epitaxially growing the epitaxy region, a main spacer is formed on an outer edge of the thin spacer. After the step of forming the main spacer, a deep source/drain implantation is performed to form a deep source/drain region for the FinFET.
Public/Granted literature
- US20110223736A1 LDD Epitaxy for FinFETs Public/Granted day:2011-09-15
Information query
IPC分类: