发明授权
- 专利标题: Method for fabricating semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US13171642申请日: 2011-06-29
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公开(公告)号: US08283240B2公开(公告)日: 2012-10-09
- 发明人: Keiichi Yui , Isao Makabe , Ken Nakata , Takamitsu Kitamura , Akira Furuya
- 申请人: Keiichi Yui , Isao Makabe , Ken Nakata , Takamitsu Kitamura , Akira Furuya
- 申请人地址: JP Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2010-150057 20100630
- 主分类号: H01L21/20
- IPC分类号: H01L21/20
摘要:
A method for fabricating a semiconductor device includes forming an AlN layer on a substrate made of silicon by supplying an Al source without supplying a N source and then supplying both the Al source and the N source, and forming a GaN-based semiconductor layer on the AlN layer after the forming of the AlN layer. The forming of the AlN layer grows the AlN layer so as to satisfy the following: 76500/x0.81
公开/授权文献
- US20120003820A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 公开/授权日:2012-01-05
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