发明授权
US08283596B2 Laser processing apparatus and laser processing method, debris collection mechanism and debris collection method, and method for producing display panel
失效
激光加工设备和激光加工方法，碎片收集机构和碎片收集方法以及生产显示面板的方法
- 专利标题： Laser processing apparatus and laser processing method, debris collection mechanism and debris collection method, and method for producing display panel
- 专利标题（中）： 激光加工设备和激光加工方法，碎片收集机构和碎片收集方法以及生产显示面板的方法
-
申请号： US12138050申请日： 2008-06-12
-
公开(公告)号： US08283596B2公开(公告)日： 2012-10-09
- 发明人: Hidehisa Murase , Yoshinari Sasaki , Kosei Aso , Naoki Yamada
- 申请人： Hidehisa Murase , Yoshinari Sasaki , Kosei Aso , Naoki Yamada
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： SNR Denton US LLP
- 优先权： JP2007-169381 20070627
- 主分类号： B23K26/00
- IPC分类号： B23K26/00 ; B29C35/08
摘要：
A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.
公开/授权文献
信息查询
