发明授权
- 专利标题: Band saw cutting apparatus and ingot cutting method
- 专利标题(中): 带锯切割设备和锭切割方法
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申请号: US13056780申请日: 2009-08-12
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公开(公告)号: US08286623B2公开(公告)日: 2012-10-16
- 发明人: Hidehiko Nishino , Yoshihiro Hirano , Junichi Uchida
- 申请人: Hidehiko Nishino , Yoshihiro Hirano , Junichi Uchida
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2008-241587 20080919
- 国际申请: PCT/JP2009/003876 WO 20090812
- 国际公布: WO2010/032371 WO 20100325
- 主分类号: B28D1/06
- IPC分类号: B28D1/06 ; B28D1/08 ; B28D1/12
摘要:
The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolant spraying opening for spraying a coolant on the blade, the band saw cutting apparatus cutting the ingot by relatively feeding the blade from above to below, the blade being driven to rotate by rotating the pulleys, wherein the pulleys is configured to be rotatable about an axis thereof in both directions, and a direction of driving to rotate the blade can be changed to cut the ingot. As a result, there is provided a band saw cutting apparatus and an ingot cutting method that can stably secure the quality of the ingot to be cut, increase the lifetime of the blade, and improve the productivity.
公开/授权文献
- US20110126814A1 BAND SAW CUTTING APPARATUS AND INGOT CUTTING METHOD 公开/授权日:2011-06-02