发明授权
- 专利标题： Substrate support for high throughput chemical treatment system
- 专利标题（中）： 基材支持高通量化学处理系统
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申请号： US12183694申请日： 2008-07-31
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公开(公告)号： US08287688B2公开(公告)日： 2012-10-16
- 发明人: Jay R. Wallace , Hiroyuki Takahashi
- 申请人： Jay R. Wallace , Hiroyuki Takahashi
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 主分类号： C23F1/08
- IPC分类号： C23F1/08
摘要：
A high throughput chemical treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment. A substrate support in the chemical treatment system is configured to support a plurality of substrates.