发明授权
- 专利标题： Electronic device comprising electrically stable copper filled electrically conductive adhesive
- 专利标题（中）： 电子器件包括电稳定的铜填充导电粘合剂
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申请号： US12032645申请日： 2008-02-16
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公开(公告)号： US08293141B2公开(公告)日： 2012-10-23
- 发明人: Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
- 申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Nugent & Smith LLP
- 代理商 Theresa O'Rourke Nugent
- 主分类号： H01B1/06
- IPC分类号： H01B1/06 ; H01B1/02
摘要：
An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.