Invention Grant
- Patent Title: Encapsulated materials and methods for encapsulating materials
- Patent Title (中): 封装材料的封装材料和方法
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Application No.: US12481394Application Date: 2009-06-09
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Publication No.: US08293271B2Publication Date: 2012-10-23
- Inventor: Kyekyoon Kim , Hyungsoo Choi
- Applicant: Kyekyoon Kim , Hyungsoo Choi
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of The University of Illinois
- Current Assignee: The Board of Trustees of The University of Illinois
- Current Assignee Address: US IL Urbana
- Agency: Guntin Meles & Gust, PLC
- Agent Andrew Gust
- Main IPC: A61K9/48
- IPC: A61K9/48 ; A61K35/12

Abstract:
A system that incorporates teachings of the present disclosure may include, for example, an apparatus having an outer nozzle operable to discharge an outer stream of a shell solution, and an inner nozzle operable to discharge an inner stream of a core solution intermixed with a plurality of materials. The outer stream can substantially surrounds the inner stream, thereby forming a combined stream. A plurality of capsules can be formed responsive to a force applied to the combined stream. At least a portion of the plurality of capsules are desirable capsules, each having a core encapsulated by a portion of the shell solution. The core can have at least one of the plurality of materials encapsulated by a portion of the core solution without protruding an outer surface of the portion of the shell solution. Additional embodiments are disclosed.
Public/Granted literature
- US20090304788A1 ENCAPSULATED MATERIALS AND METHODS FOR ENCAPSULATING MATERIALS Public/Granted day:2009-12-10
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