发明授权
US08293629B2 High full-well capacity pixel with graded photodetector implant
有权
具有渐变光电探测器植入物的高全阱容量像素
- 专利标题: High full-well capacity pixel with graded photodetector implant
- 专利标题(中): 具有渐变光电探测器植入物的高全阱容量像素
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申请号: US12755088申请日: 2010-04-06
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公开(公告)号: US08293629B2公开(公告)日: 2012-10-23
- 发明人: Duli Mao , Hsin-Chih Tai , Vincent Venezia , Yin Qian , Howard E. Rhodes
- 申请人: Duli Mao , Hsin-Chih Tai , Vincent Venezia , Yin Qian , Howard E. Rhodes
- 申请人地址: US CA Santa Clara
- 专利权人: OmniVision Technologies, Inc.
- 当前专利权人: OmniVision Technologies, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely Sokoloff Taylor & Zafman LLP
- 主分类号: H01L21/425
- IPC分类号: H01L21/425
摘要:
Embodiments of a process for forming a photodetector region in a CMOS pixel by dopant implantation, the process comprising masking a photodetector area of a surface of a substrate for formation of the photodetector region, positioning the substrate at a plurality of twist angles, and at each of the plurality of twist angles, directing dopants at the photodetector area at a selected tilt angle. Embodiments of a CMOS pixel comprising a photodetector region formed in a substrate, the photodetector region comprising overlapping first and second dopant implants, wherein the overlap region has a different dopant concentration than the non-overlapping parts of the first and second implants, a floating diffusion formed in the substrate, and a transfer gate formed on the substrate between the photodetector and the transfer gate. Other embodiments are disclosed and claimed.
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