发明授权
- 专利标题： Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide
- 专利标题（中）： 热塑性组合物包括导热填料和超支化聚酯酰胺
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申请号： US12582758申请日： 2009-10-21
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公开(公告)号： US08293831B2公开(公告)日： 2012-10-23
- 发明人: Yuji Saga , Wei W. Zhang
- 申请人： Yuji Saga , Wei W. Zhang
- 申请人地址： US DE Wilmington
- 专利权人： E I du Pont de Nemours and Company
- 当前专利权人： E I du Pont de Nemours and Company
- 当前专利权人地址： US DE Wilmington
- 主分类号： C08K3/16
- IPC分类号： C08K3/16
摘要：
Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C.; a thermally conducting filler having a thermal conductivity of at least 5 W/mK, for instance CaF2 powder; and at least one hyperbranched polyesteramide having terminal hydroxy groups; and molded articles made therefrom.
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