发明授权
- 专利标题： Semiconductor device and fabricating method thereof
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US12788845申请日： 2010-05-27
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公开(公告)号： US08294276B1公开(公告)日： 2012-10-23
- 发明人: Sang Won Kim , Boo Yang Jung , Sung Kyu Kim , Min Yoo , Seung Jae Lee
- 申请人： Sang Won Kim , Boo Yang Jung , Sung Kyu Kim , Min Yoo , Seung Jae Lee
- 申请人地址： US AZ Chandler
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Chandler
- 代理机构： McKay and Hodgson, LLP
- 代理商 Serge J. Hodgson
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.
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