公开(公告)号：US20100167951A1

公开(公告)日：2010-07-01

申请号：US12522392

申请日：2007-01-08

Applicant: Sang Yup Lee ,  Seung Min Yoo ,  Ki-Chang Keum ,  Nae-Choon Yoo ,  Won-Min Yoo ,  June-Myung Kim ,  Jun Yong Choi

Inventor： Sang Yup Lee ,  Seung Min Yoo ,  Ki-Chang Keum ,  Nae-Choon Yoo ,  Won-Min Yoo ,  June-Myung Kim ,  Jun Yong Choi

IPC: C40B40/06 ,  C07H21/04

CPC classification number: C12Q1/689 ,  C12Q1/6837

Abstract: The present invention relates to nucleic acid probes specific to Staphylococcus aureus, which is useful for detecting and identifying S. aureus in a biological sample. More particularly, the present invention relates to a DNA chip for detecting and identifying S. aureus, on which nucleic acid probes derived from 23 S rRNA gene of S. aureus are immobilized. The application of the DNA chips according to the present invention allows time-saving and accurate diagnosis of bacterial infection compared with the conventional bacterial culture methods.

Abstract translation: 本发明涉及对金黄色葡萄球菌特异性的核酸探针，其可用于检测和鉴定生物样品中的金黄色葡萄球菌。 更具体地，本发明涉及用于检测和鉴定金黄色葡萄球菌的DNA芯片，其上固定有金黄色葡萄球菌23S rRNA基因的核酸探针。 与常规细菌培养方法相比，根据本发明的DNA芯片的应用允许节省细菌感染的准确诊断。

公开(公告)号：US20100167956A1

公开(公告)日：2010-07-01

申请号：US12522390

申请日：2007-01-08

Applicant: Sang Yup LEE ,  Seung Min YOO ,  So Youn SHIN ,  Ki-Chang Keum ,  Nae-Choon YOO ,  Won-Min YOO ,  June-Myung KIM ,  Jun Yong CHOI

Inventor： Sang Yup LEE ,  Seung Min YOO ,  So Youn SHIN ,  Ki-Chang Keum ,  Nae-Choon YOO ,  Won-Min YOO ,  June-Myung KIM ,  Jun Yong CHOI

IPC: C40B40/08 ,  C07H21/04

CPC classification number: C12Q1/689 ,  C12Q1/6837

Abstract: The present invention relates to nucleic acid probes specific to E. coli, which is useful for detecting and identifying E. coli in a biological sample. More particularly, the present invention relates to a DNA chip for detecting and identifying E. coli, on which nucleic acid probes derived from 23 S rRNA gene of E. coli are immobilized. The application of the DNA chip according to the present invention allows time-saving and accurate diagnosis of bacterial infection compared with the conventional of bacterial culture methods. In addition, it is not affected by antibiotics addition in clinical practice, thus leading to more accurate diagnosis.

Abstract translation: 本发明涉及对大肠杆菌特异性的核酸探针，其可用于检测和鉴定生物样品中的大肠杆菌。 更具体地，本发明涉及用于检测和鉴定大肠杆菌的DNA芯片，其上固定有大肠杆菌23S rRNA基因的核酸探针。 根据本发明的DNA芯片的应用与常规的细菌培养方法相比，可以节省细菌感染的准确诊断。 此外，临床实践中不受抗生素添加的影响，从而导致更准确的诊断。

公开(公告)号：US09369895B2

公开(公告)日：2016-06-14

申请号：US14124584

申请日：2012-06-01

Applicant: Ill Soo Sohn ,  Sunghyun Choi ,  Seung Min Yoo ,  Hyewon Lee ,  Mun Hwan Choi ,  Yong Ho Seok ,  Ok Hwan Lee

Inventor： Ill Soo Sohn ,  Sunghyun Choi ,  Seung Min Yoo ,  Hyewon Lee ,  Mun Hwan Choi ,  Yong Ho Seok ,  Ok Hwan Lee

IPC: H04B7/04 ,  H04B7/06 ,  H04W24/08

CPC classification number: H04W24/08 ,  H04B7/0452 ,  H04B7/0617 ,  H04B7/0634 ,  H04B7/065

Abstract: The present invention relates to a method and device for channel measurement in a wireless LAN system. A station (STA) receives a plurality of sounding frames from an access point (AP), estimates the plurality of sounding frames in order to generate long-term channel state information (LCSI), provides the generated LCSI to the AP as feedback, and receives from the AP a group identifier (ID) management frame comprising information on a group ID determined on the basis of the LCSI.

Abstract translation: 本发明涉及无线LAN系统中的信道测量方法和装置。 站点（STA）从接入点（AP）接收多个探测帧，估计多个探测帧以产生长期信道状态信息（LCSI），将生成的LCSI作为反馈提供给AP，以及 从AP接收包括基于LCSI确定的组ID的信息的组标识符（ID）管理帧。

公开(公告)号：US08467199B2

公开(公告)日：2013-06-18

申请号：US12832656

申请日：2010-07-08

Applicant: Jun-Young Lee ,  Yu-Seok Jeong ,  Hyung-Jun Chae ,  Kwang-Min Yoo ,  Jae-Jin Chang ,  Jae-Ha Chang

Inventor： Jun-Young Lee ,  Yu-Seok Jeong ,  Hyung-Jun Chae ,  Kwang-Min Yoo ,  Jae-Jin Chang ,  Jae-Ha Chang

IPC: H02M3/335

CPC classification number: H02M3/33584 ,  H02M2001/007 ,  Y02B70/1433 ,  Y02P80/112

Abstract: A two-stage insulated bidirectional DC/DC power converter is disclosed. A two-stage insulated bidirectional DC/DC power converter according to an embodiment of the invention has the characteristic of including: an LLC resonant converter operating at a constant duty ratio; a bidirectional converter joined to a front part of the LLC resonant converter and configured to perform a booster converter function of outputting the input voltage at a consistent input voltage for the LLC resonant converter, and a buck converter function of reducing the voltage by way of the LLC resonant converter and then outputting a consistent voltage; and a bidirectional converter control unit configured to control changes in an input voltage of the bidirectional converter and regulate an output voltage of the LLC resonant converter to thereby maintain a consistent input voltage of the LLC resonant converter, such that the LLC resonant converter operates at a constant duty ratio.

Abstract translation: 公开了一种两级绝缘双向DC / DC电力转换器。 根据本发明的实施例的两级绝缘双向DC / DC电力转换器具有包括：以恒定占空比工作的LLC谐振变换器的特征; 连接到LLC谐振转换器的前部的双向转换器，并且被配置为执行用于为LLC谐振转换器输出一致输入电压的输入电压的升压转换器功能，以及降压转换器功能，其通过 LLC谐振变换器，然后输出一致的电压; 以及双向转换器控制单元，被配置为控制所述双向转换器的输入电压的变化并调节所述LLC谐振变换器的输出电压，从而保持所述LLC谐振变换器的一致的输入电压，使得所述LLC谐振变换器在 恒功率

公开(公告)号：US08441123B1

公开(公告)日：2013-05-14

申请号：US12540593

申请日：2009-08-13

Applicant: Dong Hee Lee ,  Min Yoo ,  Dae Byoung Kang ,  Bae Yong Kim

Inventor： Dong Hee Lee ,  Min Yoo ,  Dae Byoung Kang ,  Bae Yong Kim

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/26145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/014

Abstract: A semiconductor device has a first semiconductor die having at least one metal pillar formed along an inner perimeter and at least one bond pad formed along an outer perimeter. A second semiconductor die has at least one metal pillar. A conductive bump connects the at least one metal pillar of the first semiconductor die to the at least one metal pillar of the second semiconductor die. At least one metal dam is formed on the first semiconductor die between the at least one metal pillar of the first semiconductor die and the at least one bond pad.

Abstract translation: 半导体器件具有第一半导体管芯，该第一半导体管芯具有沿着内周边形成的至少一个金属柱和沿外周形成的至少一个接合焊盘。 第二半导体管芯具有至少一个金属柱。 导电凸块将第一半导体管芯的至少一个金属柱连接到第二半导体管芯的至少一个金属柱。 在第一半导体管芯上的至少一个金属柱与第一半导体管芯的至少一个接合焊盘之间形成至少一个金属坝。

公开(公告)号：US20120322684A1

公开(公告)日：2012-12-20

申请号：US13546972

申请日：2012-07-11

Applicant: Sang Yup Lee ,  Nae Choon Yoo ,  So Young Yoo ,  Hyun Cheol Chung ,  Ki Chang Keum ,  Won Min Yoo ,  Ki Jun Jeong

Inventor： Sang Yup Lee ,  Nae Choon Yoo ,  So Young Yoo ,  Hyun Cheol Chung ,  Ki Chang Keum ,  Won Min Yoo ,  Ki Jun Jeong

IPC: C07K14/535 ,  C12Q1/68 ,  C40B30/04 ,  C07H21/04

CPC classification number: C07K16/243 ,  C12Q1/6886 ,  C12Q2600/156

Abstract: Disclosed are a method, a composition, a microarray, an antibody and a kit for diagnosis and prognosis of cancer, based on detection of deletion of the exon 3 region of G-CSF gene or levels of a mutated G-CSF protein having a deletion of an amino acid sequence corresponding to the exon 3 region, wherein the deletion of the exon 3 region of the G-CSF gene is used as a cancer biomarker.

Abstract translation: 公开了基于检测到G-CSF基因的外显子3区的缺失或具有缺失的突变的G-CSF蛋白的水平的方法，组合物，微阵列，抗体和用于癌症诊断和预后的试剂盒 的对应于外显子3区域的氨基酸序列，其中G-CSF基因的外显子3区域的缺失被用作癌症生物标志物。

公开(公告)号：US20120252527A1

公开(公告)日：2012-10-04

申请号：US13436407

申请日：2012-03-30

Applicant: Sang-Su Kim ,  Dong-Min Yoo ,  Tae-Woo Noh ,  Seung-Joo Hyun

Inventor： Sang-Su Kim ,  Dong-Min Yoo ,  Tae-Woo Noh ,  Seung-Joo Hyun

IPC: H04M1/00

CPC classification number: H04M1/67 ,  H03K17/941 ,  H04M2250/12

Abstract: An apparatus and method is configured to detect the proximity of an object using a proximity sensor in a portable terminal. A method for detecting the proximity of an object in a portable terminal mounted with a proximity sensor includes setting a reference light-receiving quantity according to a hairstyle of a user of the portable terminal, emitting light, detecting a light-receiving quantity corresponding to the emitted light, and determining the proximity/non-proximity of an object by comparing the light-receiving quantity with the reference light-receiving quantity.

Abstract translation: 一种装置和方法被配置为使用便携式终端中的接近传感器来检测物体的接近度。 用于检测安装有接近传感器的便携式终端中的物体的接近度的方法包括根据便携式终端的用户的发型设置参考光接收量，发射光，检测对应于 发射光，以及通过将光接收量与参考光接收量进行比较来确定对象的接近度/非接近度。

公开(公告)号：US08089148B1

公开(公告)日：2012-01-03

申请号：US12539116

申请日：2009-08-11

Applicant: Jun Su Lee ,  Min Jae Lee ,  Jae Dong Kim ,  Jae Jin Lee ,  Min Yoo ,  Byung Jun Kim

Inventor： Jun Su Lee ,  Min Jae Lee ,  Jae Dong Kim ,  Jae Jin Lee ,  Min Yoo ,  Byung Jun Kim

IPC: H01L23/48

CPC classification number: H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/32225 ,  H01L2924/00012

Abstract: A circuit board has an insulative layer including a first surface and a second surface opposite to the first surface. A plurality of electrically conductive patterns is formed on the first surface of the insulative layer. Conductive lands are formed in a die mounting region of the first surface of the insulative layer and electrically connected to one of the plurality of conductive patterns on the first surface. An extending pattern extends from the conductive lands to outside of the mounting region. A protective layer covers the first surface of the insulative layer and the electrically conductive patterns. A trench is formed in the protective layer to expose the conductive lands and the extending patterns.

Abstract translation: 电路板具有包括与第一表面相对的第一表面和第二表面的绝缘层。 在绝缘层的第一表面上形成多个导电图案。 导电焊盘形成在绝缘层的第一表面的管芯安装区域中，并且与第一表面上的多个导电图案之一电连接。 延伸图案从导电焊盘延伸到安装区域的外部。 保护层覆盖绝缘层的第一表面和导电图案。 在保护层中形成沟槽以暴露导电焊盘和延伸图案。

公开(公告)号：US07867317B2

公开(公告)日：2011-01-11

申请号：US12310324

申请日：2008-07-28

Applicant: Jae Chun Lee ,  Jae Min Yoo ,  Jin Ki Jeong ,  Manis Kumar Jha

Inventor： Jae Chun Lee ,  Jae Min Yoo ,  Jin Ki Jeong ,  Manis Kumar Jha

IPC: C22B3/22 ,  B01D43/00

CPC classification number: H05K3/22 ,  C22B7/005 ,  C22B7/006 ,  H05K2203/0783 ,  H05K2203/105 ,  H05K2203/178 ,  Y02P10/234 ,  Y02P70/613 ,  Y10T29/49751

Abstract: A method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, a method for liberating metal and plastic laminated in waste printed circuit boards uses an organic solvent and then separates and recovers the liberated metal components using an electrostatic separation process.

Abstract translation: 用于回收废电子机的印刷电路板中所含的有价值金属的方法，更具体地说，一种用于释放层叠在废印刷电路板中的金属和塑料的方法使用有机溶剂，然后使用静电分离分离和回收释放的金属组分 处理。

公开(公告)号：US07859107B1

公开(公告)日：2010-12-28

申请号：US12798412

申请日：2010-04-02

Applicant: Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

Inventor： Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

IPC: H01L23/12

CPC classification number: H05K3/3478 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2224/03828 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/111 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K2201/10734 ,  H05K2203/033 ,  H05K2203/043 ,  H05K2203/0485 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.

Abstract translation: 焊接附着膜包括第一覆盖膜，焊剂层，焊料层和第二覆盖膜，并且其可以被处理或保持为辊状。 使用焊料附着膜的焊球形成方法包括制备半导体封装或半导体管芯，粘附焊料附着膜，网格化和回流。 在焊料附着膜附着操作中，去除第一覆盖膜和第二覆盖膜，并且将焊剂层粘附到半导体封装或半导体管芯的导电焊盘。 随后，在回流操作中，磁通层被挥发除去，焊料层被熔融固定在导电焊盘上，从而形成焊球。