Invention Grant
- Patent Title: Semiconductor device and fabricating method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US12788845Application Date: 2010-05-27
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Publication No.: US08294276B1Publication Date: 2012-10-23
- Inventor: Sang Won Kim , Boo Yang Jung , Sung Kyu Kim , Min Yoo , Seung Jae Lee
- Applicant: Sang Won Kim , Boo Yang Jung , Sung Kyu Kim , Min Yoo , Seung Jae Lee
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: McKay and Hodgson, LLP
- Agent Serge J. Hodgson
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.
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