Invention Grant
- Patent Title: Current rectifying element, memory device incorporating current rectifying element, and fabrication method thereof
- Patent Title (中): 电流整流元件,并联电流整流元件的存储器件及其制造方法
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Application No.: US12669174Application Date: 2008-07-11
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Publication No.: US08295123B2Publication Date: 2012-10-23
- Inventor: Takeshi Takagi , Takumi Mikawa , Koji Arita , Mitsuteru Iijima , Takashi Okada
- Applicant: Takeshi Takagi , Takumi Mikawa , Koji Arita , Mitsuteru Iijima , Takashi Okada
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-186622 20070718
- International Application: PCT/JP2008/001867 WO 20080711
- International Announcement: WO2009/011113 WO 20090122
- Main IPC: G11C13/00
- IPC: G11C13/00

Abstract:
In a current rectifying element (10), a barrier height φA of a center region (14) of a barrier layer (11) in a thickness direction thereof sandwiched between a first electrode layer (12) and a second electrode layer (13) is formed to be larger than a barrier height φB of a region in the vicinity of an interface (17) between the barrier layer (11) and the first electrode layer (12) and an interface (17) between the barrier layer (11) and the second electrode layer (13). The barrier layer (11) has, for example, a triple-layer structure of barrier layers (11a), (11b) and (11c). The barrier layers (11a), (11b) and (11c) are, for example, formed by SiN layers of SiNx2, SiNx1, and SiNx1 (X1
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