Abstract:
A method for programming a nonvolatile memory element includes: decreasing a resistance value of a variable resistance element in an initial state, by applying an initialization voltage pulse to a series circuit in which a load resistor having a first resistance value is connected in series with the variable resistance element and a MSM diode; applying, after the decreasing, a write voltage pulse to the series circuit after the resistance value of the variable resistance element is changed to a second resistance value lower than the first resistance value; and applying, after the decreasing, an erase voltage pulse to the series circuit after the resistance value of the variable resistance element is changed to a third resistance value lower than the first resistance value.
Abstract:
Provided is a method for reading data from a variable resistance nonvolatile storage element, where the operation for reading data is less susceptible to a fluctuation phenomenon of resistance values in reading the data. The method includes: detecting a current value Iread that flows through the nonvolatile storage element that can be in a low resistance state RL and a high resistance state RH, with application of a fixed voltage; and determining that (i) the nonvolatile storage element is in a high resistance state when the current value Iread detected in the detecting is smaller than a current reference level Iref, and (ii) the nonvolatile storage element is in a low resistance state when the current value Iread detected in the detecting is larger than the reference level Iref, the current reference level Iref being defined by (IRL+IRH)/2
Abstract:
An analyzing device includes a feeder connected to a container in which a sample is contained for sucking the sample from the container and feeding the sample, and a controller for performing control for feeding from the feeder to a measurer. In measuring the sample, the controller performs control so that results of a plurality of times of measurement are obtained with respect to the single container in which the sample is contained, without changing the container. This arrangement allows quick accuracy check.
Abstract:
A method for driving a nonvolatile memory element includes: a writing step of changing a variable resistance layer to a low resistance state, by applying a writing voltage pulse having a first polarity; and an erasing step of changing the variable resistance layer to a high resistance state, by applying an erasing voltage pulse having a second polarity different from the first polarity, wherein in the writing step, a first input and output terminal of a field effect transistor is a source terminal of the transistor, and when a pulse width of the writing voltage pulse is PWLR and a pulse width of the erasing voltage pulse is PWHR, PWLR and PWHR satisfy a relationship of PWLR
Abstract:
Provided is a method for reading data from a variable resistance nonvolatile storage element, where the operation for reading data is less susceptible to a fluctuation phenomenon of resistance values in reading the data. The method includes: detecting a current value Iread that flows through the nonvolatile storage element that can be in a low resistance state RL and a high resistance state RH, with application of a fixed voltage; and determining that (i) the nonvolatile storage element is in a high resistance state when the current value Iread detected in the detecting is smaller than a current reference level Iref, and (ii) the nonvolatile storage element is in a low resistance state when the current value Iread detected in the detecting is larger than the reference level Iref, the current reference level Iref being defined by (IRL+IRH)/2
Abstract:
A variable resistance nonvolatile storage device which includes (i) a semiconductor substrate (301), (ii) a variable resistance element (309) having: lower and upper electrodes (309a, 309c); and a variable resistance layer (309b) whose resistance value reversibly varies based on voltage signals each of which has a different polarity and is applied between the electrodes (309a, 309c), and (iii) a MOS transistor (317) formed on the substrate (301), wherein the variable resistance layer (309b) includes: oxygen-deficient transition metal oxide layers (309b-1, 309b-2) having compositions MOX and MOy (where x
Abstract:
A nonvolatile memory element includes first and second electrodes, and a resistance variable layer disposed therebetween. At least one of the first and second electrodes includes a platinum-containing layer. The resistance variable layer includes a first oxygen-deficient transition metal oxide layer which is not physically in contact with the platinum-containing layer and a second oxygen-deficient transition metal oxide layer which is disposed between the first oxygen-deficient transition metal oxide layer and the platinum-containing layer and is physically in contact with the platinum-containing layer. When oxygen-deficient transition metal oxides included in the first and second oxygen-deficient transition metal oxide layers are expressed as MOx, and MOy, respectively, x
Abstract:
A nonvolatile memory element (100) includes a variable resistance layer (107) including a first metal oxide MOx and a second metal oxide MOy, and reaction energy of chemical reaction related to the first metal oxide, the second metal oxide, oxygen ions, and electrons is 2 eV or less. The chemical reaction is expressed by a formula 13, where a combination (MOx, MOy) of MOx and MOy is selected from a group including (Cr2O3, CrO3), (Co3O4, Co2O3), (Mn3O4, Mn2O3), (VO2, V2O5), (Ce2O3, CeO2), (W3O8, WO3), (Cu2O, CuO), (SnO, SnO2), (NbO2, Nb2O5), and (Ti2O3, TiO2). [Mathematical Expression 13] MOx+(y−x)O2−MOy+2(y−x)e− (Formula 13)
Abstract translation:非易失性存储元件(100)包括可变电阻层(107),其包括第一金属氧化物MOx和第二金属氧化物MOy,以及与第一金属氧化物,第二金属氧化物,氧离子和 电子为2eV以下。 化学反应由式13表示,其中MOx和MOy的组合(MOx,MOy)选自(Cr 2 O 3,CrO 3),(Co 3 O 4,Co 2 O 3),(Mn 3 O 4,Mn 2 O 3),(VO 2,V 2 O 5) ),(Ce 2 O 3,CeO 2),(W3O 8,WO 3),(Cu 2 O,CuO),(SnO,SnO 2),(NbO 2,Nb 2 O 5)和(Ti 2 O 3,TiO 2)。 [数学表达式13] MOx +(y-x)O2-MOy + 2(y-x)e-(式13)
Abstract:
A nonvolatile memory element of the present invention comprises a first electrode (503); a second electrode (505); and a resistance variable layer (504) which is disposed between the first electrode (503) and the second electrode (505), a resistance value of the resistance variable layer being changeable in response to electric signals which are applied between the first electrode (503) and the second electrode (505), wherein the first electrode and the second electrode comprise materials which are made of different elements.
Abstract:
Provided is a nonvolatile memory element achieving a stable resistance change and miniaturization, and a method of manufacturing the same. The nonvolatile memory element includes: a first electrode formed above a substrate; an interlayer insulating layer formed above the substrate including the first electrode and having a memory cell hole reaching the first electrode; a barrier layer formed in the memory cell hole and composed of a semiconductor layer or an insulating layer connected to the first electrode; a second electrode formed in the memory cell hole and connected to the barrier layer; a variable resistance layer formed on the second electrode and having a stacked structure whose resistance value changes based on electric signals; and a third electrode connected to the variable resistance layer and formed on the interlayer insulating layer to cover the memory cell hole.