发明授权
- 专利标题: Cleaning device and cleaning method of semiconductor manufacturing apparatus
- 专利标题(中): 半导体制造装置的清洗装置及清洗方法
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申请号: US12510314申请日: 2009-07-28
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公开(公告)号: US08297292B2公开(公告)日: 2012-10-30
- 发明人: Takayuki Kokubo , Jun Yamawaku , Tsuyoshi Moriya
- 申请人: Takayuki Kokubo , Jun Yamawaku , Tsuyoshi Moriya
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Pearne & Gordon LLP
- 优先权: JP2008-193425 20080728
- 主分类号: B08B3/04
- IPC分类号: B08B3/04
摘要:
Provided are a cleaning device and a cleaning method of a semiconductor manufacturing apparatus, capable of performing a cleaning process more effectively as compared to conventional cases and obtaining a high cleaning effect. A semiconductor manufacturing apparatus cleaning device 100 includes a pure water steam generating vessel 2 for generating pure water steam from pure water; a supply port 5 for supplying the pure water steam to a cleaning target portion; a supply line 4 for connecting the pure water steam generating vessel with the supply port; a collection port 6 for collecting steam used in cleaning from the cleaning target portion; a collection vessel 8 for condensing and collecting the used steam; and a collection line 7 for connecting the collection port 6 with the collection vessel 8.
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