发明授权
- 专利标题： Process for wet singulation using a dicing singulation structure
- 专利标题（中）： 使用切割分离结构进行湿分离的方法
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申请号： US12423254申请日： 2009-04-14
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公开(公告)号： US08298917B2公开(公告)日： 2012-10-30
- 发明人: Paul S. Andry , Timothy H. Daubenspeck , Jeffrey P. Gambino , Edmund J. Sprogis , Cornelia K. Tsang
- 申请人： Paul S. Andry , Timothy H. Daubenspeck , Jeffrey P. Gambino , Edmund J. Sprogis , Cornelia K. Tsang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Gibb & Riley, LLC
- 代理商 Richard M. Kotulak, Esq.
- 主分类号： H01L23/544
- IPC分类号： H01L23/544
摘要：
A method includes receiving at least one wafer having a front side and a backside, where the front side has a plurality of integrated circuit chips thereon. The backside of the wafer is thinned, a pattern of material is removed from the backside of the wafer to form a plurality of dicing trenches. Each of the dicing trenches are positioned opposite a location on the front side of the wafer that corresponds to edges of each of the plurality of chips. The dicing trenches are filled with a filler material and a dicing support is attached to a front side of the wafer. The filler material is removed from the dicing trenches, and a force is applied to the dicing support to separate each of the plurality of chips on the wafer from each other along the dicing trenches.
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