A film-chip complex includes a film which includes a connection region along one side, a chip which is mounted on the film, a gate signal line which is disposed on the film, wherein the gate signal line includes a gate lead which is disposed in the connection region and a gate main line which connects the chip with the gate lead and a signal line which is disposed on the film, wherein the signal line includes a signal lead which is disposed in the connection region, a signal main line which extends substantially toward an exterior of the connection region and a signal pad which is connected with the signal main line.