Invention Grant
US08304662B2 Buildup board, and electronic component and apparatus having the buildup board
有权
建筑板，以及具有积木板的电子部件和装置
- Patent Title: Buildup board, and electronic component and apparatus having the buildup board
- Patent Title (中): 建筑板，以及具有积木板的电子部件和装置
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Application No.: US11806680Application Date: 2007-06-01
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Publication No.: US08304662B2Publication Date: 2012-11-06
- Inventor: Akiyoshi Saitou , Takeshi Midorikawa , Toru Kuraishi , Chikayuki Kumagai , Masashi Fujimoto , Kenichiro Abe
- Applicant: Akiyoshi Saitou , Takeshi Midorikawa , Toru Kuraishi , Chikayuki Kumagai , Masashi Fujimoto , Kenichiro Abe
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2006-153964 20060601; JP2007-141005 20070528
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.
Public/Granted literature
- US20070295533A1 Buildup board, and electronic component and apparatus having the buildup board Public/Granted day:2007-12-27
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