发明授权
US08304662B2 Buildup board, and electronic component and apparatus having the buildup board
有权
建筑板，以及具有积木板的电子部件和装置
- 专利标题： Buildup board, and electronic component and apparatus having the buildup board
- 专利标题（中）： 建筑板，以及具有积木板的电子部件和装置
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申请号： US11806680申请日： 2007-06-01
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公开(公告)号： US08304662B2公开(公告)日： 2012-11-06
- 发明人: Akiyoshi Saitou , Takeshi Midorikawa , Toru Kuraishi , Chikayuki Kumagai , Masashi Fujimoto , Kenichiro Abe
- 申请人： Akiyoshi Saitou , Takeshi Midorikawa , Toru Kuraishi , Chikayuki Kumagai , Masashi Fujimoto , Kenichiro Abe
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Kratz, Quintos & Hanson, LLP
- 优先权： JP2006-153964 20060601; JP2007-141005 20070528
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.
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