发明授权
US08304766B2 Semiconductor chip with a bonding pad having contact and test areas
有权
具有焊盘的半导体芯片具有接触和测试区域
- 专利标题： Semiconductor chip with a bonding pad having contact and test areas
- 专利标题（中）： 具有焊盘的半导体芯片具有接触和测试区域
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申请号： US13094780申请日： 2011-04-26
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公开(公告)号： US08304766B2公开(公告)日： 2012-11-06
- 发明人: Mou-Shiung Lin , Huei-Mei Yen , Hsin-Jung Lo , Chiu-Ming Chou , Ke-Hung Chen
- 申请人： Mou-Shiung Lin , Huei-Mei Yen , Hsin-Jung Lo , Chiu-Ming Chou , Ke-Hung Chen
- 申请人地址： TW Hsinchu
- 专利权人： Megica Corporation
- 当前专利权人： Megica Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： McDermott Will & Emery LLP
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/00
摘要：
A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.
公开/授权文献
- US20110198589A1 SEMICONDUCTOR CHIP 公开/授权日：2011-08-18
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