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公开(公告)号：US20110198589A1
公开(公告)日：2011-08-18
申请号：US13094780
申请日：2011-04-26
申请人： Mou-Shiung Lin , Huei-Mei Yen , Chiu-Ming Chou , Hsin-Jung Lo , Ke-Hung Chen
发明人： Mou-Shiung Lin , Huei-Mei Yen , Chiu-Ming Chou , Hsin-Jung Lo , Ke-Hung Chen
IPC分类号： H01L23/58 , H01L23/532
CPC分类号： H01L24/11 , H01L22/32 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/94 , H01L2224/02166 , H01L2224/0231 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05553 , H01L2224/05557 , H01L2224/05558 , H01L2224/05572 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/1147 , H01L2224/1191 , H01L2224/11912 , H01L2224/13021 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/16 , H01L2224/274 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/1305 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.
摘要翻译： 半导体芯片包括由钝化层中的开口暴露的金属焊盘，其中金属焊盘具有测试区域和接合区域。 在测试步骤中，测试探头与测试区域接触进行电气测试。 在测试步骤之后，在测试区域上形成由测试探针产生的探针标记的聚合物层。 或者，半导体芯片包括分别由钝化层中的两个开口露出的测试焊盘和接合焊盘，其中测试焊盘连接到焊盘。 在测试步骤中，测试探针与测试垫接触进行电气测试。 在测试步骤之后，在测试垫上形成由测试探针产生的探针标记的聚合物层。
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公开(公告)号：US08304766B2
公开(公告)日：2012-11-06
申请号：US13094780
申请日：2011-04-26
申请人： Mou-Shiung Lin , Huei-Mei Yen , Hsin-Jung Lo , Chiu-Ming Chou , Ke-Hung Chen
发明人： Mou-Shiung Lin , Huei-Mei Yen , Hsin-Jung Lo , Chiu-Ming Chou , Ke-Hung Chen
CPC分类号： H01L24/11 , H01L22/32 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/94 , H01L2224/02166 , H01L2224/0231 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05553 , H01L2224/05557 , H01L2224/05558 , H01L2224/05572 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/1147 , H01L2224/1191 , H01L2224/11912 , H01L2224/13021 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/16 , H01L2224/274 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/1305 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.
摘要翻译： 半导体芯片包括由钝化层中的开口暴露的金属焊盘，其中金属焊盘具有测试区域和接合区域。 在测试步骤中，测试探头与测试区域接触进行电气测试。 在测试步骤之后，在测试区域上形成由测试探针产生的探针标记的聚合物层。 或者，半导体芯片包括分别由钝化层中的两个开口露出的测试焊盘和接合焊盘，其中测试焊盘连接到焊盘。 在测试步骤中，测试探针与测试垫接触进行电气测试。 在测试步骤之后，在测试垫上形成由测试探针产生的探针标记的聚合物层。
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公开(公告)号：US07947978B2
公开(公告)日：2011-05-24
申请号：US11567182
申请日：2006-12-05
申请人： Mou-Shiung Lin , Huei-Mei Yen , Chiu-Ming Chou , Hsin-Jung Lo , Ke-Hung Chen
发明人： Mou-Shiung Lin , Huei-Mei Yen , Chiu-Ming Chou , Hsin-Jung Lo , Ke-Hung Chen
CPC分类号： H01L24/11 , H01L22/32 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/94 , H01L2224/02166 , H01L2224/0231 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05553 , H01L2224/05557 , H01L2224/05558 , H01L2224/05572 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/1147 , H01L2224/1191 , H01L2224/11912 , H01L2224/13021 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/16 , H01L2224/274 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/1305 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.
摘要翻译： 半导体芯片包括由钝化层中的开口暴露的金属焊盘，其中金属焊盘具有测试区域和接合区域。 在测试步骤中，测试探头与测试区域接触进行电气测试。 在测试步骤之后，在测试区域上形成由测试探针产生的探针标记的聚合物层。 或者，半导体芯片包括分别由钝化层中的两个开口露出的测试焊盘和接合焊盘，其中测试焊盘连接到焊盘。 在测试步骤中，测试探针与测试垫接触进行电气测试。 在测试步骤之后，在测试垫上形成由测试探针产生的探针标记的聚合物层。
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公开(公告)号：US20070164279A1
公开(公告)日：2007-07-19
申请号：US11567182
申请日：2006-12-05
申请人： Mou-Shiung Lin , Huei-Mei Yen , Chiu-Ming Chou , Hsin-Jung Lo , Ke-Hung Chen
发明人： Mou-Shiung Lin , Huei-Mei Yen , Chiu-Ming Chou , Hsin-Jung Lo , Ke-Hung Chen
IPC分类号： H01L23/58
CPC分类号： H01L24/11 , H01L22/32 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/94 , H01L2224/02166 , H01L2224/0231 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05553 , H01L2224/05557 , H01L2224/05558 , H01L2224/05572 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/1147 , H01L2224/1191 , H01L2224/11912 , H01L2224/13021 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/16 , H01L2224/274 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/1305 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.
摘要翻译： 半导体芯片包括由钝化层中的开口暴露的金属焊盘，其中金属焊盘具有测试区域和接合区域。 在测试步骤中，测试探头与测试区域接触进行电气测试。 在测试步骤之后，在测试区域上形成由测试探针产生的探针标记的聚合物层。 或者，半导体芯片包括分别由钝化层中的两个开口露出的测试焊盘和接合焊盘，其中测试焊盘连接到焊盘。 在测试步骤中，测试探针与测试垫接触进行电气测试。 在测试步骤之后，在测试垫上形成由测试探针产生的探针标记的聚合物层。
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