发明授权
- 专利标题： Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method
- 专利标题（中）： 根据该方法制造纤维增强印刷电路板面板和纤维增强面板的方法
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申请号： US12882122申请日： 2010-09-14
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公开(公告)号： US08307548B2公开(公告)日： 2012-11-13
- 发明人: William O. Alger , Gary B. Long , Gary A. Brist , Bryce D. Horine
- 申请人： William O. Alger , Gary B. Long , Gary A. Brist , Bryce D. Horine
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H05K3/02
- IPC分类号： H05K3/02 ; B29C65/00
摘要：
A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.