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US08308052B2 Thermal gradient reflow for forming columnar grain structures for solder bumps 有权
用于形成用于焊料凸块的柱状晶粒结构的热梯度回流

Thermal gradient reflow for forming columnar grain structures for solder bumps
摘要：
A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.
摘要（中）：

一种方法包括加热包括第一工件和第二工件的包装结构，以熔化第一和第二工件之间的多个焊料凸块; 并且在加热步骤之后，允许多个焊料凸点固化。 在固化步骤期间，使用加热源将封装结构的第一侧保持在比多个焊料凸块的熔化温度高的第一温度。 在固化步骤期间，通过使用冷却源将封装结构的第二面保持在低于熔融温度的第二温度，其中第二侧与第一侧相对。

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