发明授权
- 专利标题： Method for manufacturing a package-on-package type semiconductor device
- 专利标题（中）： 制造封装型封装型半导体器件的方法
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申请号： US12900407申请日： 2010-10-07
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公开(公告)号： US08314493B2公开(公告)日： 2012-11-20
- 发明人: Takashi Kikuchi , Tomoaki Hashimoto , Tatsuya Hirai
- 申请人： Takashi Kikuchi , Tomoaki Hashimoto , Tatsuya Hirai
- 申请人地址： JP Kawasaki-shi
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kawasaki-shi
- 代理机构： Miles & Stockbridge P.C.
- 优先权： JP2009-238459 20091015
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.
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