发明授权
- 专利标题: Printed circuit board with reduced dielectric loss
- 专利标题(中): 具有降低介电损耗的印刷电路板
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申请号: US12797244申请日: 2010-06-09
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公开(公告)号: US08319113B2公开(公告)日: 2012-11-27
- 发明人: Moises Cases , Bradley D. Herrman , Bhyrav M. Mutnury , Nam H. Pham , Terence Rodrigues
- 申请人: Moises Cases , Bradley D. Herrman , Bhyrav M. Mutnury , Nam H. Pham , Terence Rodrigues
- 申请人地址: US NY Armonk
- 专利权人: International Buisness Machines Corporation
- 当前专利权人: International Buisness Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Biggers & Ohanian, LLP
- 代理商 H. Barrett Spraggins; Cynthia G. Seal
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H05K3/00
摘要:
A printed circuit board (‘PCB’) with reduced dielectric loss, including conductive traces disposed upon layers of dielectric material, the layers of dielectric material including core layers and prepreg layers, one or more of the layers of dielectric material including pockets of air that reduce an overall relative dielectric constant of the PCB.
公开/授权文献
- US20110303445A1 Printed Circuit Board With Reduced Dielectric Loss 公开/授权日:2011-12-15
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