发明授权
- 专利标题： Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
- 专利标题（中）： 用无芯封装形成用于电磁干扰屏蔽的金属填充模具背面膜
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申请号： US12755201申请日： 2010-04-06
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公开(公告)号： US08319318B2公开(公告)日： 2012-11-27
- 发明人: Ravi K Nalla , Drew Delaney
- 申请人： Ravi K Nalla , Drew Delaney
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L23/34
摘要：
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a cavity in a carrier material, attaching a die in the cavity, wherein a backside of the die comprises a metal filled DBF, forming a dielectric material adjacent the die and on a bottom side of the carrier material, forming a coreless substrate by building up layers on the dielectric material, and removing the carrier material from the coreless substrate.
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