- 专利标题： Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
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申请号： US12966215申请日： 2010-12-13
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公开(公告)号： US08323873B2公开(公告)日： 2012-12-04
- 发明人: Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
- 申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JPP2005-196328 20050705; JPP2005-332955 20051117
- 主分类号： G03F7/00
- IPC分类号： G03F7/00 ; G03F7/004 ; G03F7/027
摘要：
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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