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1.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件公开(公告)号：US20080176167A1
公开(公告)日：2008-07-24
申请号：US11969358
申请日：2008-01-04
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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公开(公告)号：US20110065260A1
公开(公告)日：2011-03-17
申请号：US12950398
申请日：2010-11-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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3.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US08673539B2
公开(公告)日：2014-03-18
申请号：US13672847
申请日：2012-11-09
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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4.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US08445177B2
公开(公告)日：2013-05-21
申请号：US12950353
申请日：2010-11-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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5.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件公开(公告)号：US20100314783A1
公开(公告)日：2010-12-16
申请号：US12859720
申请日：2010-08-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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6.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US07851131B2
公开(公告)日：2010-12-14
申请号：US11969358
申请日：2008-01-04
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; （C）光聚合引发剂。
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7.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件公开(公告)号：US20130062787A1
公开(公告)日：2013-03-14
申请号：US13672847
申请日：2012-11-09
IPC分类号： H01L23/488
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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公开(公告)号：US08323873B2
公开(公告)日：2012-12-04
申请号：US12966215
申请日：2010-12-13
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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公开(公告)号：US08293453B2
公开(公告)日：2012-10-23
申请号：US12950398
申请日：2010-11-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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10.发明授权Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part 有权感光性粘合剂组合物，使用该粘合剂组合物，粘合剂膜，粘合片，具有粘合剂层的半导体晶片，半导体器件和电子部件公开(公告)号：US08278024B2
公开(公告)日：2012-10-02
申请号：US12859720
申请日：2010-08-19
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。
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